The clock speed of smart phone chips is getting higher and higher, which will generate a lot of heat. Excessive heat will affect the user's comfort and may also burn out the hardware. Therefore, major manufacturers will consider how smart phones dissipate heat.
After entering 2019, mobile phone heat dissipation has once again become a new hot spot in the market, driven by the rigid demand of mobile phones in the future. For example, Xiaomi’s flagship gaming phone, the Black Shark, is equipped with a multi-stage direct-touch integrated heat and cold cooling system. Its main heat dissipation part is copper, and only the middle slender part has a very small amount of built-in liquid; there is also Honor Note10, which uses The Nine heat and cold heat dissipation technology adds a liquid-cooled heat dissipation layer to the original eight-layer heat dissipation, and uses graphite paste heat conduction and heat pipe; in addition, Meizu 16 also uses water-cooled heat dissipation, and heat conduction is applied to the surface of the processor. Silicone grease, further enhance the thermal conductivity function!
With the advent of the 5G era, mobile phone heat dissipation has become a hot spot in the industry. In the case that the battery capacity of smart phones cannot be greatly increased, in addition to developing solutions to reduce energy consumption, the importance of heat dissipation for smart phones has become more prominent. , The current glass back cover will become the mainstream of the market, and its heat dissipation performance is worse than that of the metal back cover. This is also an important reason why many current glass back cover mobile phones use graphite sheets on the glass back cover! According to market news, Huawei's 5G mobile phone is expected to use 0.4mm copper sheet and apply thermal grease to fill the gap as the core heat dissipation component of the mobile phone!
5G mobile phone antennas and RF front-ends will undergo major changes. High-frequency mobile phone antennas are also expected to adopt active methods. The power consumption of mobile phones will increase significantly. Cooling technology solutions will be crucial, in addition to traditional graphite heat dissipation and liquid-cooled heat pipe heat dissipation. In addition to technology, there will be future heat dissipation technologies, including some new heat dissipation materials that will also be applied in smart phones.
With the increasing application of heat-dissipating components in mobile phones and PCs, many companies have laid out heat-dissipating components and materials. With the advent of the 5G+ Internet of Things era, the degree of intelligence of mobile phones in the future and the degree of people’s dependence on mobile phones will be different. As the direction of smart phone research and development, the application of heat dissipation technology in smart phones will become more and more important. The demand for heat dissipation will also drive changes in heat dissipation materials and research on new technologies. More and more companies will carry out layout or industrial upgrades in this field.