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      Smart Security Thermal Solution


      The security system belongs to the category of the electronics industry and is a comprehensive utilization of modern computer technology, integrated circuit application technology, network control and transmission technology, and software technology. Security products can be roughly divided into three categories: video surveillance, access control and anti-theft alarm. From the “visible” to “clear” transition, and then to today’s intelligence, the security industry’s initiative has been continuously enhanced, and edge perception + intelligence has gradually become the new goal of the smart security industry, highly intelligent The era of comprehensive security has come.

      Intelligent security puts forward higher requirements for image transmission speed, definition, video storage time and data analysis. While this combination increases the cost of the video surveillance storage solution, the heat flow density and heat generation of its circuit system are also increasing, which puts tremendous pressure on the manageability of the overall smart security solution. As we all know, the operating temperature of electronic devices directly determines their service life and stability, and heat dissipation has become an important indicator of product performance in the electronics industry, especially the heat dissipation of surveillance cameras. In practical applications, if the core chip temperature is too high due to poor heat dissipation, it is easy to cause a series of thermal faults such as blurring of the monitoring picture, packet loss, error code, and restarting.


       Cameras are gradually moving toward high-end images such as 1080P, 4K, and 8K. High-definition pixels are moving closer. Advanced technologies such as high-definition image processing and big data operations have made thermal management and EMI shielding issues increasingly prominent. High power consumption and heat generation and a closed environment puts forward higher requirements on the overall heat dissipation scheme. The volatilization of thermal material molecules, the precipitation of silicone oil, and the phenomenon of silicon migration are important to the optical lens; the low temperature resistance of the chip becomes the heat dissipation bottleneck, how to reduce the interface Thermal resistance is an important factor to consider in thermal design.

      In order to ensure the stable and reliable operation of the camera, it is urgent to reduce the thermal load of the core components and alleviate the thermal stress concentration of the circuit board. Light Titanium Technology's low volatility, high thermal conductivity, low oil penetration, super soft and other high-performance interface materials (high-performance thermal grease, graphene thermal pad, graphite thermal soaking film, alloy thermal paste, etc.), have passed high temperature aging tests , Provide professional thermal management solutions for the security industry to ensure the safety of the normal operation of security products and the reliability of long-term operation.